HSC2625 查看數據表（PDF） - Hi-Sincerity Microelectronics

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HSC2625

NPN EPITAXIAL PLANAR TRANSISTOR

Hi-Sincerity Microelectronics 

HI-SINCERITY

MICROELECTRONICS CORP.

TO-3P Dimension

Spec. No. : HR200201

Issued Date : 1996.03.14

Revised Date : 2002.08.13

Page No. : 2/2

A

B

r1

C

D

r2

E

R

S

a2

GH I H

F

a1

a3

123

J

Marking:

H

SC

2625

Date Code

Control Code

Style: Pin 1.Base 2.Collector 3.Emitter

K

L

M

T

N

OP

U

a1

a1 r3

a1

a1

3-Lead TO-3P Plastic Package,

HSMC Package Code: R

DIM

Inches

Min.

Max.

Millimeters

Min.

Max.

A

0.6063 0.6220 15.40

15.80

B

0.5276 0.5433 13.40

13.80

C

0.3701 0.3858

9.40

9.80

D

-

*0.3150

-

*8.00

E

0.1417 0.1575

3.60

4.00

F

0.5394 0.5551 13.70

14.10

G

0.4945 0.5102 12.56

12.96

H

0.7756 0.7913 19.70

20.10

I

0.9134 0.9291 23.20

23.60

J

0.1299 0.1457

3.30

3.70

K

0.0709 0.0866

1.80

2.20

L

0.1102 0.1260

2.80

3.20

M

0.6378 0.6614 16.20

16.80

DIM

Inches

Min.

Max.

N

0.0315 0.0472

O

0.2028 0.2264

P

0.2028 0.2264

Q

0.7283 0.7441

R

0.1811 0.1969

S

0.0571 0.0650

T

0.0472 0.0630

a1

-

*3o

a2

-

*2o

a3

-

*1o

r1

φ3.10

φ3.30

r2

-

*φ1.60

r3

-

*R0.50

*: Typical

Millimeters

Min.

Max.

0.80

1.20

5.15

5.75

5.15

5.75

18.50

18.90

4.60

5.00

1.45

1.65

1.20

1.60

-

*3o

-

*2o

-

*1o

φ3.10

φ3.30

-

*φ1.60

-

*R0.50

Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

Tel: 886-3-5983621~5 Fax: 886-3-5982931

HSC2625

HSMC Product Specification

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