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ADP3152 查看數據表(PDF) - Analog Devices

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ADP3152 Datasheet PDF : 12 Pages
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ADP3152
Board Layout Guidelines
1. The power loop should be routed on the PCB to encompass
small areas to minimize radiated switching noise energy to
the control circuit and thus to avoid circuit problems caused
by noise. This technique also helps to reduce radiated EMI.
The power loop includes the input capacitors, the two
MOSFETs, the sense resistor, the inductor, and the output
capacitors. The ground terminals of the input capacitors, the
low side FET, the ADP3152, and the output capacitors
should be connected together with short and wide traces. It is
best to use an internal ground plane.
2. The PGND (power ground) pin of the ADP3152 must re-
turn to the grounded terminals of the input and output ca-
pacitors and to the source of the low side MOSFET with the
shortest and widest traces possible. The AGND (analog
ground) pin has to be connected to the ground terminals of
the timing capacitor and the compensating capacitor, again
with the shortest leads possible, and before it is connected to
the PGND pin.
3. The positive terminal of the input capacitors must be con-
nected to the drain of the high side MOSFET. The source
terminal of this FET is connected to the drain of the low side
FET, (whose source is connected to the ground plane direct)
with the widest and shortest traces possible. To kill parasitic
ringing at the input of the buck inductor due to parasitic
capacitances and inductances, a small (L >3 mm) ferrite
bead is recommended to be placed in the drain lead of the
low side FET. Also, to minimize dissipation of the high side
FET, a low voltage 1 A Schottky diode can be connected
between the input of the buck inductor and the source of the
low side FET.
4. The positive terminal of the bypass capacitors of the +12 V
supply must be connected to the VIN pin of the ADP3152
with the shortest leads possible. The negative terminals must
be connected to the PGND pin of the ADP3152.
5. The sense pins of the ADP3152 must be connected to the
sense resistor with as short traces as possible. Make sure that
the two sense traces are routed together with minimum sepa-
ration (<1 mm). The output side of the sense resistor should
be connected to the VCC pin(s) of the CPU with as short and
wide PCB traces as possible to reduce the VCC voltage drop.
(Each square unit of 1 ounce Cu-trace has a resistance of
~0.53 m. At 14 A, each mof PCB trace resistance be-
tween current sense resistor output and VCC terminal(s) of
the CPU will reduce the regulated output voltage by 14 mV.
The filter capacitors to ground at the sense terminals of the
IC should be as close as possible (<8 mm) to the ADP3152.
The common ground of the optional filter capacitors should
be connected to the AGND pin of the ADP3152 with the
shortest traces possible (<10 mm).
6. The microprocessor load should be connected to the output
terminals of the converter with the widest and shortest traces
possible. Use overlapping traces in different layers to mini-
mize interconnection inductance.
REV. 0
–11–

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