ADUM6400 查看數據表（PDF） - Analog Devices
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ADUM6400 Datasheet PDF : 28 Pages
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ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404
Data Sheet
Table 13. Input and Output Characteristics
Parameter
Symbol
DC SPECIFICATIONS
Logic High Input Threshold
VIH
Logic Low Input Threshold
VIL
Min
0.7 × VISO or
0.7 × VDD1
Logic High Output Voltages
VOH
Logic Low Output Voltages
VOL
VDD1 − 0.2 or
VISO − 0.2
VDD1 − 0.5 or
VISO − 0.5
Undervoltage Lockout
UVLO
Positive-Going Threshold
VUV+
Negative-Going Threshold VUV−
Hysteresis
VUVH
Input Currents per Channel
II
−10
AC SPECIFICATIONS
Output Rise/Fall Time
tR/tF
Common-Mode Transient
Immunity1
|CM|
25
Refresh Rate
fr
Typ
VDD1 or VISO
VDD1 − 0.2 or
VISO − 0.2
0.0
0.0
2.7
2.4
0.3
+0.01
2.5
35
1.0
Max
0.3 × VISO or
0.3 × VDD1
0.1
0.4
+10
Unit Test Conditions/Comments
V
V
V
IOx = −20 μA, VIx = VIxH
V
IOx = −4 mA, VIx = VIxH
V
IOx = 20 μA, VIx = VIxL
V
IOx = 4 mA, VIx = VIxL
VDD1, VDDL, VISO supplies
V
V
V
μA
0 V ≤ VIx ≤ VDDx
ns
kV/μs
Mbps
10% to 90%
VIx = VDD1 or VISO, VCM = 1000 V,
transient magnitude = 800 V
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.7 × VDD1 or 0.7 × VISO for a high input or VO < 0.3 × VDD1 or 0.3 × VISO for a low
input. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.
PACKAGE CHARACTERISTICS
Table 14.
Parameter
RESISTANCE AND CAPACITANCE
Resistance (Input-to-Output)1
Capacitance (Input-to-Output)1
Input Capacitance2
IC Junction-to-Ambient Thermal
Resistance
THERMAL SHUTDOWN
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
Symbol Min
Typ
RI-O
1012
CI-O
2.2
CI
4.0
θJA
45
TSSD
150
TSSD-HYS
20
Max
Unit
Test Conditions/Comments
Ω
pF
pF
°C/W
f = 1 MHz
Thermocouple is located at the center of
the package underside; test conducted
on a 4-layer board with thin traces3
°C
TJ rising
°C
1 This device is considered a 2-terminal device; Pin 1 through Pin 8 are shorted together, and Pin 9 through Pin 16 are shorted together.
2 Input capacitance is from any input data pin to ground.
3 Refer to the Thermal Analysis section for thermal model definitions.
Rev. A | Page 8 of 28
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