AMMC-6233(2007) 查看數據表（PDF） - Avago Technologies
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AMMC-6233 Datasheet PDF : 9 Pages
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Biasing and Operation
The AMMC-6233 is normally biased with a positive supply
connected to both VD1 and VD2 bond pads through
the 100pF bypass capacitor as shown in Figure 19. The
recommended supply voltage is 3 V. It is important to
place the bypass capacitor as close to the die as possible.
No negative gate bias voltage is needed for the AMMC-
6233. Input and output 50-ohm match are achieved
on-chip; therefore no other external component is
required at the input or output. In addition, the input
and output are DC-blocked with internal coupling
capacitors.
No ground wires are needed because all ground
connections are made with plated through-holes to the
backside of the device.
Refer the Absolute Maximum Ratings table for allowed
DC and thermal conditions.
The location of the RF bond pads is shown in Figure
12. Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is normally
sufficient for signal connections, however double
bonding with 0.7 mil gold wire or use of gold mesh[2] is
recommended for best performance, especially near the
high end of the frequency band.
Thermosonic wedge bonding is preferred method for
wire attachment to the bond pads. Gold mesh can be
attached using a 2 mil round tracking tool and a tool
force of approximately 22 grams and a ultrasonic power
of roughly 55 dB for a duration of 76 ± 8 mS. The guided
wedge at an untrasonic power level of 64 dB can be
used for 0.7 mil wire. The recommended wire bond stage
temperature is 150 ± 2C.
Assembly Techniques
The backside of the MMIC chip is RF ground. For
microstrip applications the chip should be attached
directly to the ground plane (e.g. circuit carrier or
heatsink) using electrically conductive epoxy.[1]
For best performance, the topside of the MMIC should
be brought up to the same height as the circuit
surrounding it. This can be accomplished by mounting
a gold plate metal shim (same length and width as
the MMIC) under the chip which is of correct thickness
to make the chip and adjacent circuit the same height.
The amount of epoxy used for the chip and/or shim
attachment should be just enough to provide a thin
fillet around the bottom perimeter of the chip or shim.
The ground plan should be free of any residue that may
jeopardize electrical or mechanical attachment.
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and time.
The chip is 100um thick and should be handled with care.
This MMIC has exposed air bridges on the top surface and
should be handled by the edges or with a custom collet
(do not pick up the die with a vacuum on die center).
This MMIC is also static sensitive and ESD precautions
should be taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Buckbee-Mears Corporation, St. Paul, MN, 800-262-
3824.
VD1
VD2
OUT
IN
Figure 17. AMMC-6233 simplified schematic
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