AS1109-BSSU 查看數據表（PDF） - austriamicrosystems AG
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AS1109-BSSU Datasheet PDF : 25 Pages
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AS1109
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Electrical Parameters
Min
Max
Units
Comments
VDD to GND
-0.3
7
V
Input Voltage
Output Voltage
-0.4 VDD + 0.4 V
-0.4
15
V
GND Pin Current
1000
mA
Input Current (latch-up immunity)
Electrostatic Discharge
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge HBM
2
kV
Temperature Ranges and Storage Conditions
Norm: MIL 883 E method 3015
33
ºC/W
on PCB, 16-pin SOIC-150 package
Thermal Resistance ΘJA
113
ºC/W
on PCB, 16-pin QSOP-150 package
32
ºC/W
on PCB, 16-pin QFN (4x4mm) package
Storage Temperature Range
-55
+150
ºC
Package Body Temperature
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
+260
ºC
Classification for Non-Hermetic Solid State Surface
Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing
5
85
%
QFN and QSOP
1
Moisture Sensitive Level Moisture Sensitive
Layer (SOIC)
3
Represents a maximum floor life time of unlimited
Represents a maximum floor life of 168h
www.ams.com/LED-Driver-ICs/AS1109
Revision 1.21
3 - 24
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