BY228 查看數據表（PDF） - Philips Electronics

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BY228

Damper Diodes / SOD64 Package.

Philips Electronics 

Philips Semiconductors

Damper diode

Product specification

BY228

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

Rth j-tp

Rth j-a

thermal resistance from junction to tie-point

thermal resistance from junction to ambient

CONDITIONS

lead length = 10 mm

note 1

mounted as shown in Fig.5

VALUE

25

75

40

UNIT

K/W

K/W

K/W

Note

1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.4.

For more information please refer to the “General Part of associated Handbook”.

1996 Sep 26

3

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