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BZA100 Datasheet PDF : 8 Pages
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NXP Semiconductors
18-fold ESD transient voltage
suppressor
Product data sheet
BZA100
FEATURES
• SO20 SMD package allows 18
separate voltage regulator diodes
in a common anode configuration
• Working voltage: typ. 6.8 V
• Forward voltage: max. 1.3 V
• Maximum reverse peak power
dissipation: 27.5 W at tp = 1 ms
• Maximum clamping voltage at peak
pulse current: 11 V at 2.5 A
• Low leakage current: max. 2 µA
• ESD rating >8 kV, according
IEC 801-2.
APPLICATIONS
• Where transient overvoltage
protection in voltage and ESD
sensitive equipment is required
such as:
– Computers
– Printers
– Business machines
– Communication systems
– Medical equipment.
DESCRIPTION
18-fold monolitic transient voltage
suppressor. Its 18-fold junction
common anode design protects 18
separate lines using only one
package. This device is ideal for
situations where board space is a
premium.
PINNING
PIN
DESCRIPTION
1 to 5
6 and 16
7 to 15
17 to 20
cathode (k1 to k5)
common anode (a1; a2)
cathode (k6 to k14)
cathode (k15 to k18)
handkb1ook,14 columns
k2 2
k3 3
k4 4
k5 5
a1 6
SO20
k6 7
k7 8
k8 9
k9 10
20 k18
19 k17
18 k16
17 k15
16 a2
15 k14
14 k13
13 k12
12 k11
11 k10
20 19 18 17 16 15 14 13 12 11
1 2 3 4 5 6 7 8 9 10
MBG396
Fig.1 Pin configuration for SO20 (SOT163-1) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
IZ
working current
IF
continuous forward current
IFSM
non-repetitive peak forward current
IZSM
non-repetitive peak reverse current
Ptot
total power dissipation
PZSM
Tstg
Tj
non-repetitive peak reverse power
dissipation
storage temperature
operating junction temperature
CONDITIONS
tp = 1 ms; square pulse
tp = 1 ms; square pulse; see Fig.2
see Fig.3
up to Ts = 60 °C; note 2
up to Tamb = 25 °C; note 3
tp = 1 ms; square pulse; see Fig.4
MIN.
−
−
−
−
−
−
−
−65
−
MAX.
note 1
200
4
2.5
1.6
1.25
27.5
+150
150
Notes
1. DC working current limited by Ptot max.
2. One or more diodes loaded; Ts is the temperature at the soldering point.
3. One or more diodes loaded; device mounted on a printed-circuit board with Rth a-s = 43.5 K/W.
UNIT
mA
mA
A
A
W
W
W
°C
°C
1997 Dec 02
2
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