BZT52C10 查看數據表（PDF） - Yea Shin Technology Co., Ltd
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BZT52C10 Datasheet PDF : 3 Pages
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DATA SHEET
SEMICONDUCTOR
BZT52C2V4-BZT52C51
SOD-123 Plastic-Encapsulate Diode
ZENER DIODE
SOD123 Unit:inch(mm)
FEATURES
•Planar Die Construction
•500mW Power Dissipation on Ceramic PCB
•General Purpose Medium Current
•Ideally Suited for Automated Assembly
Processes
•High temperature soldering : 260OC / 10 seconds at terminals
•Pb free product at available : 99% Sn above meet RoHS
environment substance directive request
Maximum Ratings (Tamb=25℃ unless otherwise specified)
Symbol
A
A1
A2
b
c
D
E
E1
L
L1
θ
Characteristic
Forward Voltage @ IF = 10mA
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
VF
Pd
RθJA
Tj, TSTG
Dimensions In Millimeters
Min
1.050
Max
1.250
0.000
0.100
1.050
1.150
0.450
0.650
0.080
0.150
1.500
1.700
2.600
2.800
3.550
3.850
0.500 REF
0.250
0.450
0°
8°
Value
0.9
500
305
-55 to +150
Dimensions In Inches
Min
0.041
Max
0.049
0.000
0.004
0.041
0.045
0.018
0.026
0.003
0.006
0.059
0.067
0.102
0.110
0.140
0.152
0.020 REF
0.010
0.018
0°
8°
Unit
V
mW
℃/W
℃
http://www.yeashin.com
1
REV.02 20120403
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