BZT52C2V4(2010) 查看數據表（PDF） - Micro Commercial Components
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BZT52C2V4 Datasheet PDF : 3 Pages
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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BZT52C2V4
THRU
BZT52C43
Features
x Planar Die Construction
x 500mW Power Dissipation on Ceramic PCB
x General Purpose Medium Current
x Ideally Suited for Automated Assembly Processes
x Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
• Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
500 mW
Zener Diode
2.4 to 43 Volts
SOD123
A
Absolute Maximum Ratings
B
Symbol
Rating
Rating
Unit
C
E
PD
Power dissipation
500
mW
TJ
Junction Temperature
-65 to +150
к
TSTG
Storage Temperature Range
-65 to +150
к
H
D
Absolute Maximum Ratings
Symbol
Rating
Rating
Unit
RthJA
Thermal Resistance Junction to
Ambient*
250
к/W
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm2
Electrical Characteristics
Symbol
Rating
Rating
Unit
VF
Maximum Forward Voltage
(IF=10mAdc)
0.9
V
J
G
DIMENSIONS
DIM
INCHES
MM
NOTE
MIN MAX MIN MAX
A .140 .152 3.55 3.85
B .100 .112 2.55 2.85
C .055 .071 1.40 1.80
D ----- .053 ----- 1.35
E .012 .031 0.30 .78
G .006 ----- 0.15 -----
H ----- .01 ----- .25
J ----- .006 ----- .15
SUGGESTED SOLDER
PAD LAYOUT
0.093"
0.048”
Revision: 10
www.mccsemi.com
1 of 3
0.036”
2010/03/01
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