HFBR-5302 查看數據表（PDF） - HP => Agilent Technologies

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HFBR-5302

Fibre Channel 133 MBd and 266 MBd Transceivers in Low Cost 1x9 Package Style

HP => Agilent Technologies 

ELECTRICAL SUBASSEMBLY

DATA OUT

DUPLEX SC

RECEPTACLE

PIN

SIGNAL

DETECT

OUT

QUANTIZER IC

PREAMP IC OPTICAL

SUBASSEMBLIES

The electrical subassembly con-

sists of a high volume multilayer

printed circuit board to which the

IC chips and various surface-

mount passive circuit elements

are attached.

DATA IN

DRIVER IC

LED

Figure 1. Block Diagram.

TOP VIEW

The package outline drawing and

pin out are shown in Figures 2

and 3. The details of this package

outline and pin out are compliant

with the multisource definition of

the 1x9 single in-line package

(SIP). The low profile of the

Hewlett-Packard transceiver

design complies with the

maximum height allowed for the

duplex SC connector over the

entire length of the package.

The optical subassemblies utilize

a high volume assembly process

together with low cost lens

elements which result in a cost

effective building block.

(319.5.1420)MAX.

12.70

(0.500)

(215.0.4000)MAX.

H HFBR-5XXX

DATE CODE (YYWW)

SINGAPORE

3.30 ± 0.38

(0.130 ± 0.015)

0.75

+

-

0.08

0.05

(0.030+- 00..000032)

(100.4.3057)MAX.

AREA

RESERVED

FOR

PROCESS

PLUG

12.70

(0.500)

2.92

(0.115)

ø (00..04168)(9x)

NOTE 1

18.52

(0.729)

4.14

(0.163)

1.27

+

-

0.25

0.05

(0.050+-

0.010

0.002

)

NOTE 1

23.55

(0.927)

(200.8.3020)[8x(2.54/.100)]

16.70

(0.657)

17.32 20.32 23.32

(0.682) (0.800) (0.918)

0.87

(0.034)

23.24

(0.915)

15.88

(0.625)

NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.

DIMENSIONS ARE IN MILLIMETERS (INCHES).

Figure 2. Package Outline Drawing.

The package includes internal

shields for the electrical and

optical subassemblies to insure

high immunity to external EMI

fields and low EMI emissions.

The outer housing, including the

duplex SC connector, is molded

of filled non-conductive plastic to

provide mechanical strength and

electrical isolation. The solder

posts are isolated from the circuit

design of the transceiver, while

they can be connected to a

ground plane on the circuit

board, doing so will have no

impact on circuit performance.

The transceiver is attached to a

printed circuit board with the

nine signal pins and the two

solder posts which exit the

bottom of the housing. The two

solder posts provide the primary

mechanical strength to withstand

the loads imposed on the trans-

ceiver by mating with the duplex

SC connectored fiber cables.

Application Information

The Applications Engineering

group in the Hewlett-Packard

Optical Communication Division

is available to assist with the

technical understanding and

design trade-offs associated with

these transceivers. You can

contact them through your local

Hewlett-Packard sales

representative.

The following information is

provided to answer some of the

most common questions about

the use of these parts.

216

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