SST89E554 查看數據表（PDF） - Silicon Storage Technology
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SST89E554 Datasheet PDF : 58 Pages
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FlashFlex51 MCU
SST89E564 / SST89V564 / SST89E554 / SST89V554
Preliminary Specifications
12.0 PACKAGING DIAGRAMS
40
CL
1
Pin #1 Identifier
.065
.075
2.020
2.070
.600
.625
.530
.557
12˚
4 places
Base Plane
Seating Plane
.220 Max.
.015 Min.
0˚
15˚
.008
.100 †
.012
.063
.045
.090
.055
.015
.100 BSC
.200
.022
.600 BSC
Note:
1. Complies with JEDEC publication 95 MS-011 AC dimensions (except as noted), although some dimensions may be more stringent.
† = JEDEC min is .115; SST min is less stringent
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .010 inches.
40.pdipPI-ILL.7
40-PIN PLASTIC DUAL IN-LINE PINS (PDIP)
SST PACKAGE CODE: PI
Optional
Pin #1 Identifier
.042
.048
.042
.048
.685 .646 †
.695 .656
TOP VIEW
.685
.695
.646 †
.656
1 44
SIDE VIEW
.147
.020 R.
.158
MAX.
.042 x45˚
.056
.025 R.
.045
.013
.021
.026
.500 .590
.032
REF. .630
BOTTOM VIEW
.050
BSC.
Note:
.050
BSC.
.020 Min.
.100
.112
.165
.180
.026
.032
44.PLCC.NJ-ILL.7
1. Complies with JEDEC publication 95 MS-018 AC dimensions (except as noted), although some dimensions may be more stringent.
† = JEDEC min is .650; SST min is less stringent
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
44-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NJ
©2001 Silicon Storage Technology, Inc.
57
S71181-03-000 9/01 384
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