SST89E554 查看數據表（PDF） - Silicon Storage Technology

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SST89E554

Flash flex 51 MCU

Silicon Storage Technology 

FlashFlex51 MCU

SST89E564 / SST89V564 / SST89E554 / SST89V554

Preliminary Specifications

Pin #1 Identifier 44

1

34

33

10.00

BSC

12.00

BSC

.30

.45

.80 BSC

11

23

1.2

max.

Note:

12

10.00

22

BSC

12.00

BSC

.09

.95

.20

1.05

.05

.45

.15

.75

1.00 ref

44.tqfp-TQJ-ILL.6

1. Complies with JEDEC publication 95 MS-026 ACB dimensions, although some dimensions may be more stringent.

2. All linear dimensions are in millimeters (min/max).

3. Coplanarity: 0.1 (±0.05) mm.

4. Package body dimensions do not include mold flash. Maximum allowable mold flash is .25mm.

44-LEAD THIN QUAD FLAT PACK (TQFP)

SST PACKAGE CODE: TQJ

0˚- 7˚

Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone 408-735-9110 • Fax 408-735-9036

www.SuperFlash.com or www.ssti.com

©2001 Silicon Storage Technology, Inc.

58

S71181-03-000 9/01 384

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