FMA219(2004) 查看數據表（PDF） - Filtronic PLC
零件编号
产品描述 (功能)
生产厂家
FMA219 Datasheet PDF : 5 Pages
| |||
PRELIMINARY
• ASSEMBLY DRAWING
FMA219
X-BAND LNA MMIC
Input and output thin film
substrates with 50Ω microstrip
transmission lines. Substrate
thickness 250µm or thinner is
recommended.
25µm dia. Au wire (x2) on
input and output ports, less
than 1000µm length each
150pF
capacitor
To +VDD
75µm nominal gap on
each side
250µm Au ribbon
recommended
Notes:
•
•
•
•
Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic or thermosonic bonding is not recommended.
The recommended die attach is conductive epoxy, following the manufacturer’s recommended curing procedure.
For eutectic die attach the maximum time at 280-300°C is 60 seconds, and should be kept to a minium.
The supply de-coupling capacitor (150 pF recommended value) should be placed as close to the MMIC as practical.
All information and specifications subject to change without notice.
Phone: +1 408 850-5790
Fax: +1 408 850-5766
http://www.filtronic.co.uk/semis
Revised: 11/22/04
Email: sales@filcsi.com
Share Link: 