GBU6005 查看數據表（PDF） - Diotech Company.
零件编号
产品描述 (功能)
生产厂家
GBU6005 Datasheet PDF : 2 Pages
| |||
GBU6005 THRU GBU610
GLASS PASSIVATED BRIDGE RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 6.0 Ampere
FEATURES
● Glass passivated chip junction
● Reliable low cost construction utilizing molded
plastic technique
● Ideal for printed circuit board
● Low reverse leakage current
● Low forward voltage drop
● High surge current capabiliy
MECHANICAL DATA
● Case:Molded plastic, GBU
● Terminals: Terminals: Leads solderable per MIL-STD-202
method 208 guaranteed
● Epoxy: UL 94V-0 rate flame retardant
● Mounting Position: Any
.752(19.1)
.720(18.3)
.073(1.85)
.057(1.45)
GBU
.874(22.2)
.860(21.8)
3.2*3.2
CHAMFER
.139(3.53)
.133(3.37)
.154(3.9)
.146(3.7)
.232(5.9)
.224(5.7)
.720(18.29)
.680(17.27)
.050(1.27)
.040(1.02)
.100(2.54)
.085(2.16)
.106(2.7)
.080(2.03) .091(2.3)
.065(1.65)
.210 .210 .210
.190 .190 .190
(5.3) (5.3) (5.3)
(4.8) (4.8) (4.8)
.022(.56)
.018(.46)
Dimensions in inches and (milimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
Symbols
GBU
6005
GBU
601
GBU
602
GBU
604
GBU
606
GBU
608
GBU
610
Units
Maximum Recurrent Peak Reverse Voltage
VRRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage
VRMS
35
70 140 280 420 560 700 V
Maximum DC Blocking Voltage
VDC
50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current with
Heatsink at TC = 100 OC
I(AV)
6.0
A
Peak Forward Surge Current, 8.3 ms Single Half-Sine
-Wave superimposed on rated load (JEDEC Method)
IFSM
175
A
Maximum Forward Voltage at 3.0 A DC and 25 OC
VF
1.0
V
Maximum Reverse Current at TA = 25 OC
at Rated DC Blocking Voltage TA = 125 OC
IR
10.0
µA
500
Typical Junction Capacitance 1)
CJ
50
pF
Typical Thermal Resistance 2)
RθJC
2.2
OC/W
Operating and Storage Temperature Range
TJ,TS
-55 to +150
OC
1) Measured at 1 MHz and applied reverse voltage of 4 VDC.
2) Thermal resistance from junction to case with device mounted on 300 mm X 300 mm X 1.6 mm Cu plate
heatsink.
Share Link: 