HCPL-0700-300 查看數據表（PDF） - HP => Agilent Technologies
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HCPL-0700-300 Datasheet PDF : 16 Pages
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9
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter
Symbol
Storage Temperature
Operating Temperature**
Average Forward Input Current
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
TS
TA
IF(AVG)
IFPK
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
IF(TRAN)
Reverse Input Voltage
VR
HCNW139/138
Input Power Dissipation
PI
Output Current (Pin 6)
IO
Emitter Base Reverse Voltage (Pin 5-7)
VEB
Min.
-55
- 40
Max.
125
85
20
40
1.0
5
3
35
60
0.5
Units
°C
°C
mA
mA
A
V
V
mW
mA
V
Supply Voltage and Output Voltage
(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation
Total Power Dissipation
Lead Solder Temperature (for Through Hole Devices)
HCNW139/138
Reflow Temperature Profile
(for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
VCC
-0.5
18
V
VCC
-0.5
7
V
PO
100
mW
PT
135
mW
260°C for 10 sec., 1.6 mm below seating plane
260°C for 10 sec., up to seating plane
See Package Outline Drawings section
Recommended Operating Conditions
Parameter
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
Symbol
VCC
IF(ON)
VF(OFF)
TA
Min.
4.5
0.5
0
0
Max.
18
12.0
0.8
70
Units
V
mA
V
°C
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