HCPL-070A-500 查看數據表（PDF） - HP => Agilent Technologies

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HCPL-070A-500

Very Low Power Consumption High Gain Optocouplers

HP => Agilent Technologies 

5

Small-Outline SO-8 Package (HCPL-070A, HCPL-073A)

8

3.937 ± 0.127

(0.155 ± 0.005)

PIN ONE 1

0.406 ± 0.076

(0.016 ± 0.003)

765

XXX

YWW

234

5.994 ± 0.203

(0.236 ± 0.008)

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

1.270 BSG

(0.050)

* 5.080 ± 0.127

(0.200 ± 0.005)

7°

45°

X

0.432

(0.017)

3.175 ± 0.127

(0.125 ± 0.005)

1.524

(0.060)

0 ~ 7°

0.228 ± 0.025

(0.009 ± 0.001)

* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

5.207 ± 0.254 (0.205 ± 0.010)

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

0.203 ± 0.102

(0.008 ± 0.004)

0.305 MIN.

(0.012)

Solder Reflow Temperature Profile

260

240

220

∆T = 115°C, 0.3°C/SEC

200

180

160

140

120

100

80

∆T = 100°C, 1.5°C/SEC

60

40

20

0

0 1 23 4 5 6

78

TIME – MINUTES

∆T = 145°C, 1°C/SEC

9 10 11 12

Note: Use of nonchlorine activated fluxes is highly recommended.

Figure 1. Solder Reflow Thermal Profile (HCPL-070A, HCPL-073A, and Gull Wing

Surface Mount Option 300 Parts).

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