HCPL-0466-500E 查看數據表（PDF） - Avago Technologies
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HCPL-0466-500E Datasheet PDF : 21 Pages
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Regulatory Information
The devices contained in this data sheet have been approved by the following agencies:
Agency/Standard
HCPL-4506 HCPL-J456 HCPL-0466 HCNW4506
Underwriters Laboratories (UL)
UL 1577
Recognized under UL 1577, Component
✔
✔
✔
✔
Recognized Program, Category FPQU2,
File E55361
Canadian Standards
Association (CSA)
File CA88324
Component
Acceptance
✔
✔
✔
✔
Notice #5
Verband Deutscher
DIN VDE 0884
Electrotechniker (VDE)
(June 1992)
✔
✔
✔
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
✔
✔
✔
✔
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
Insulation and Safety Related Specifications
Value
Parameter
Symbol HCPL-4506 HCPL-J456 HCPL-0466 HCNW4506 Units
Conditions
Minimum External L(101) 7.1
7.4
4.9
9.6
mm Measured from input
Air Gap (External
terminals to output
Clearance)
terminals, shortest
distance through air.
Minimum External L(102) 7.4
8.0
4.8
10.0 mm Measured from input
Tracking (External
terminals to output
Creepage)
terminals, shortest
distance path along body.
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08
0.5
0.08
1.0
mm Through insulation
distance, conductor to
conductor, usually the
direct distance between
the photoemitter and
photodetector inside the
optocoupler cavity.
Minimum Internal
Tracking (Internal
Creepage)
NA
NA
NA
4.0
mm Measured from input
terminals to output
terminals, along internal
cavity.
Tracking Resistance CTI
(Comparative
Tracing Index)
≥ 175
≥ 175
≥ 175
≥ 200
Volts DIN IEC 112/VDE 0303
Part 1
Isolation Group
IIIa
IIIa
IIIa
IIIa
Material Group (DIN
VDE 0110, 1/89, Table 1)
All Agilent data sheets report the creepage and clearance inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equipment designer when determining the circuit insulation require-
ments. However, once mounted on a printed circuit board, minimum creepage and clearance requirements must be
met as specified for individual equipment standards. For creepage, the shortest distance path along the surface of a
printed circuit board between the solder fillets of the input and output leads must be considered. There are recom-
mended techniques such as grooves and ribs which may be used on a printed circuit board to achieve desired creepage
and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and
insulation level.
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