HGTD3N60C3A9 查看數據表（PDF） - Harris Semiconductor
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HGTD3N60C3A9 Datasheet PDF : 9 Pages
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HGTD3N60C3, HGTD3N60C3S
TO-251AA
3 LEAD JEDEC TO-251AA PLASTIC PACKAGE
E
A
H1
b2
D
A1
TERM. 4
SEATING
PLANE
L1
L
b
b1
c
1 23
e
J1
e1
LEAD 1
LEAD 2
LEAD 3
TERM. 4
- GATE
- COLLECTOR
- EMITTER
- COLLECTOR
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.086
0.094
2.19
2.38
-
A1
0.018
0.022
0.46
0.55
3, 4
b
0.028
0.032
0.72
0.81
3, 4
b1
0.033
0.040
0.84
1.01
3
b2
0.205
0.215
5.21
5.46
3, 4
c
0.018
0.022
0.46
0.55
3, 4
D
0.270
0.290
6.86
7.36
-
E
0.250
0.265
6.35
6.73
-
e
0.090 TYP
2.28 TYP
5
e1
0.180 BSC
4.57 BSC
5
H1
0.035
0.045
0.89
1.14
-
J1
0.040
0.045
1.02
1.14
6
L
0.355
0.375
9.02
9.52
-
L1
0.075
0.090
1.91
2.28
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-251AA outline dated 9-88.
2. Solder finish uncontrolled in this area.
3. Dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 2 dated 10-95.
7
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