HGTD3N60C3S9A 查看數據表（PDF） - Harris Semiconductor
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HGTD3N60C3S9A Datasheet PDF : 9 Pages
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HGTD3N60C3, HGTD3N60C3S
TO-252AA
SURFACE MOUNT JEDEC TO-252AA PLASTIC PACKAGE
E
H1
b2
D
1
b
3
e
e1
TERM. 4
L2
b1
A
A1
SEATING
PLANE
L
L1
c
J1
0.265
(6.7)
L3
b3
0.265 (6.7)
0.070 (1.8)
BACK VIEW
0.118 (3.0)
0.063 (1.6)
0.063 (1.6)
0.090 (2.3)
0.090 (2.3)
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
LEAD 1 - GATE
LEAD 3 - EMITTER
TERM. 4 - COLLECTOR
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.086
0.094
2.19
2.38
-
A1
0.018
0.022
0.46
0.55
4, 5
b
0.028
0.032
0.72
0.81
4, 5
b1
0.033
0.040
0.84
1.01
4
b2
0.205
0.215
5.21
5.46
4, 5
b3
0.190
-
4.83
-
2
c
0.018
0.022
0.46
0.55
4, 5
D
0.270
0.290
6.86
7.36
-
E
0.250
0.265
6.35
6.73
-
e
0.090 TYP
2.28 TYP
7
e1
0.180 BSC
4.57 BSC
7
H1
0.035
0.045
0.89
1.14
-
J1
0.040
0.045
1.02
1.14
-
L
0.100
0.115
2.54
2.92
-
L1
0.020
-
0.51
-
4, 6
L2
0.025
0.040
0.64
1.01
3
L3
0.170
-
4.32
-
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. B of
JEDEC TO-252AA outline dated 9-88.
2. L3 and b3 dimensions establish a minimum mounting surface for
terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L1 is the terminal length for soldering.
7. Position of lead to be measured 0.090 inches (2.28mm) from bottom
of dimension D.
8. Controlling dimension: Inch.
9. Revision 6 dated 10-96.
8
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