UPC8172TB 查看數據表（PDF） - NEC => Renesas Technology

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UPC8172TB

SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER

NEC => Renesas Technology 

µPC8172TB

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electrostatic sensitive devices.

(2) Form a ground pattern as wide as possible to keep the minimum ground impedance (to prevent undesired os-

cillation).

(3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin.

(4) Connect a matching circuit to the RF output pin.

(5) The DC cut capacitor must be each attached to the input and output pins.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and condi-

tions other than those recommended below, contact your NEC sales representative.

Soldering Method

Infrared Reflow

VPS

Wave Soldering

Partial Heating

Soldering Conditions

Package peak temperature: 235°C or below

Time: 30 seconds or less (at 210°C)

Count: 3, Exposure limit: NoneNote

Package peak temperature: 215°C or below

Time: 40 seconds or less (at 200°C)

Count: 3, Exposure limit: NoneNote

Soldering bath temperature: 260°C or below

Time: 10 seconds or less

Count: 1, Exposure limit: NoneNote

Pin temperature: 300°C

Time: 3 seconds or less (per side of device)

Exposure limit: NoneNote

Recommended Condition Symbol

IR35-00-3

VP15-00-3

WS60-00-1

−

Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Preliminary Data Sheet P14729EJ1V0DS00

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