LM337BD2TG 查看數據表（PDF） - ON Semiconductor
零件编号
产品描述 (功能)
生产厂家
LM337BD2TG Datasheet PDF : 10 Pages
| |||
A
K
B
F
12
3
J
D
0.010 (0.254) M T
G
LM337
PACKAGE DIMENSIONS
D2T SUFFIX
CASE 936−03
(D2PAK)
ISSUE B
OPTIONAL
CHAMFER
−T
−
E
TERMINAL 4
U
S
V
H
M
L
P
N
R
C
SOLDERING FOOTPRINT*
8.38
0.33
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.386 0.403 9.804 10.236
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
E 0.045 0.055 1.143 1.397
F 0.051 REF
1.295 REF
G 0.100 BSC
2.540 BSC
H 0.539 0.579 13.691 14.707
J 0.125 MAX
3.175 MAX
K 0.050 REF
1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R
5_ REF
5_ REF
S
0.116 REF
2.946 REF
U
0.200 MIN
5.080 MIN
V
0.250 MIN
6.350 MIN
10.66
0.42
1.016
0.04
5.08
0.20
3.05
0.12
17.02
0.67
ǒ Ǔ SCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
Share Link: 