LTC6078DD 查看數據表（PDF） - Linear Technology

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LTC6078DD

Micropower Precision, Dual/Quad CMOS Rail-to-Rail Input/Output Amplifiers

Linear Technology 

LTC6078/LTC6079

APPLICATIO S I FOR ATIO

PC Board Layout

Mechanical stress on a PC board and soldering-induced

stress can cause the VOS and VOS drift to shift. The DD

and DHC packages are more sensitive to stress. A simple

way to reduce the stress-related shifts is to mount the IC

near the short edge of the PC board, or in a corner. The

board edge acts as a stress boundary, or a region where

the flexure of the board is minimum. The package should

always be mounted so that the leads absorb the stress and

not the package. The package is generally aligned with the

leads paralled to the long side of the PC board.

The most effective technique to relieve the PC board stress

is to cut slots in the board around the op amp. These slots

can be cut on three sides of the IC and the leads can exit on

the fourth side. Figure 3 shows the layout of a LTC6078DD

with slots at three sides.

LONG DIMENSION

SLOTS

60789 F03

Figure 3. Vertical Orientation of LTC6078DD with Slots

W

W

SI PLIFIED SCHE ATIC

V+

M10

M11

I1

1µA

I2

V+

V–

D4

VBIAS

M5

+IN

D3

V+

M1 M2

V– D6

V+

–IN

M6 M7

D2

D5

SHDN

BIAS

GENERATION

V–

D1

NOTE: SHDN IS ONLY AVAILABLE

M3

M4

V–

IN THE DFN10 PACKAGE

V–

Simplified Schematic of the Amplifier

R1

R2

M8

C1

A1

OUTPUT

CONTROL

A2

V+

D7

OUT

D8

V–

R3

R4

C2

M9

60789 SS

60789fa

10

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