MA4P7002F-1072T 查看數據表（PDF） - Tyco Electronics

零件编号

产品描述 (功能)

生产厂家

MA4P7002F-1072T

High Power PIN Diodes

Tyco Electronics 

MA4P MELF & HIPAX™Series

High Power PIN Diodes

V14

MELF Assembly Recommendations

♦ Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable

surfaces of MELF devices are tin plated 50 μm thick to ensure an optimum connection.

Circuit Pad Layout for MELF Diodes

Dimension

A

B

C

Package Style

1072

inches mm

0.093 2.36

0.050 1.27

0.060 1.52

Package Style

1091

inches mm

0.150

3.81

0.050

1.27

0.100

2.54

MELF Internal Construction

A

C

B

B

Ordering Information

MELF diodes are available in tape and reel in quantities as shown in table below

Package Style

Quantity (7” Reel)

Bulk Devices Per Bag

1072T

1500 or 5000

N/A

1091T

500

N/A

Tape and reel information can be found on the M/A-COM website at http://www.macomtech.com/Application Notes/pdf/M513.pdf

11 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.4155721

• China Tel: +86.21.2407.1588

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Visit www.macomtech.com for additional data sheets and product information.

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

Commitment to produce in volume is not guaranteed.

changes to the product(s) or information contained herein without notice.

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