MJD350-13(2008) 查看數據表（PDF） - Diodes Incorporated.

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MJD350-13
(Rev.:2008)

HIGH VOLTAGE PNP SURFACE MOUNT TRANSISTOR

Diodes Incorporated. 

Features

• Epitaxial Planar Die Construction

• High Collector-EmitterVoltage

• Ideally Suited for Automated Assembly Processes

• Ideal for Power Switching or Amplification Applications

• Lead Free By Design/RoHS Compliant (Note 1)

• "Green" Device (Note 2)

MJD350

HIGH VOLTAGE PNP SURFACE MOUNT TRANSISTOR

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Mechanical Data

• Case: DPAK

• Case Material: Molded Plastic, "Green" Molding Compound. UL

Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020D

• Terminals: Finish — Matte Tin annealed over Copper Leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

• Marking Information: See Page 3

• Ordering Information: See Page 3

• Weight: 0.34 grams (approximate)

COLLECTOR

3

BASE

Top View

EMITTER

Device Schematic

Maximum Ratings @TA = 25°C unless otherwise specified

4

2

1

Pin Out Configuration

Characteristic

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Continuous Collector Current

Peak Pulse Collector Current

Symbol

VCBO

VCEO

VEBO

IC

ICM

Value

-300

-300

-3

-0.5

-0.75

Unit

V

V

V

A

A

Thermal Characteristics

Characteristic

Power Dissipation @TC = 25°C

Thermal Resistance, Junction to Case

Power Dissipation @TA = 25°C (Note 3)

Thermal Resistance, Junction to Ambient

Operating and Storage Temperature Range

Symbol

PD

RθJC

PD

RθJA

TJ, TSTG

Value

15

8.33

1.56

81

-55 to +150

Unit

W

°C/W

W

°C/W

°C

Electrical Characteristics @TA = 25°C unless otherwise specified

Characteristic

OFF CHARACTERISTICS

Collector-Emitter Sustaining Voltage (Note 4)

Collector Cutoff Current

Emitter Cutoff Current

ON CHARACTERISTICS (Note 4)

DC Current Gain

Symbol Min Typ Max Unit

Test Condition

V(SUS)CEO -300

⎯

⎯

V IC = -1mA, IB = 0

ICBO

⎯

⎯

-100

μA VCB = -300V, IE = 0

IEBO

⎯

⎯

-100

μA VEB = - 3V, IC = 0

hFE

30

⎯

240

⎯ VCE = -10V, IC = -50mA

Notes:

1. No purposefully added lead.

2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

3. Device mounted on FR-4 PCB with the minimum pad size recommended.

4. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%.

MJD350

Document number: DS31608 Rev. 2 - 2

1 of 4

www.diodes.com

November 2008

© Diodes Incorporated

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