MSK106ERH(2008) 查看數據表（PDF） - M.S. Kennedy Corporation
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MSK106ERH Datasheet PDF : 7 Pages
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APPLICATION NOTES
HEAT SINKING
To select the correct heat sink for your application, refer to
the thermal model and governing equation below.
Thermal Model:
○○○○○○○○○○○○○
○C○U○R○R○EN○ T○ ○LI○M○IT○
The MSK 106RH has an on-board current limit scheme de-
signed to limit the output drivers anytime output current ex-
ceeds a predetermined limit. The following formula may be
used to determine the value of the current limit resistance nec-
essary to establish the desired current limit.
RSC=
_0_.7_
ISC
Current Limit Connection
Governing Equation:
TJ = PD X (RθJC + RθCS + RθSA) + TA
Where
TJ
PD
RθJC
RθCS
RθSA
TC
TA
TS
= Junction Temperature
= Total Power Dissipation
= Junction to Case Thermal Resistance
= Case to Heat Sink Thermal Resistance
= Heat Sink to Ambient Thermal Resistance
= Case Temperature
= Ambient Temperature
= Sink Temperature
Example:
In our example the amplifier application requires the output
to drive a 10 volt peak sine wave across a 10 ohm load for 1
amp of output current. For a worst case analysis we will treat
the 1 amp peak output current as a D.C. output current. The
power supplies are ±15 VDC.
1.) Find Power Dissipation
PD=[(quiescent current) X (+VCC - (VCC))] + [(VS - VO) X
IOUT]
=(3.5 mA) X (30V) + (5V) X (1A)
=0.1W + 6W
=6.1W
2.) For conservative design, set TJ = +125°C.
3.) For this example, worst case TA = +25°C.
4.) RθJC = 6.0°C/W
5.) Rearrange governing equation to solve for RθSA:
RθSA =(TJ - TA) / PD - (RθJC) - (RθCS)
= (125°C - 25°C) / 6.1W - (6.0°C/W) - (0.15°C/W)
= 10.2°C/W
The heat sink in this example must have a thermal resis-
tance of no more than 10.2°C/W to maintain a junction tem-
perature of less than +125°C.
See "Application Circuits" in this data sheet for additional infor-
mation on current limit connections.
POWER SUPPLY BYPASSING
Both the negative and the positive power supplies must be
effectively decoupled with a high and low frequency bypass
circuit to avoid power supply induced oscillation. An effective
decoupling scheme consists of a 0.1 microfarad ceramic ca-
pacitor in parallel with a 4.7 microfarad tantalum capacitor from
each power supply pin to ground. It is also a good practice
with high power op-amps, such as the MSK 106RH, to place a
30-50 microfarad capacitor with a low effective series resis-
tance, in parallel with the other two power supply decoupling
capacitors. This capacitor will eliminate any peak output volt-
age clipping which may occur due to poor power supply load
regulation. All power supply decoupling capacitors should be
placed as close to the package power supply pins as possible.
TOTAL DOSE RADIATION TEST
PERFORMANCE
Radiation performance curves for TID testing have been
generated for all radiation testing performed by MS
Kennedy. These curves show performance trends
throughout the TID test process and can be located in
the MSK 106RH radiation test report. The complete ra-
diation test report is available in the RAD HARD PROD-
UCTS section on the MSK website.
http://www.mskennedy.com/store.asp?pid=9951&catid=19680
3
Rev. F 6/08
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