NCP1377BDR2G 查看數據表（PDF） - ON Semiconductor
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NCP1377BDR2G Datasheet PDF : 16 Pages
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NCP1377, NCP1377B
1.5 us for B Version
4.5 us
Delay
HV
4 mA
VCC
PON
+
+
12.5 V
7.5 V
5.6 V (Fault)
OVP
Demag
5 V /1.44
+
+
+
8 us
Blanking 3 us for
B Version
S
Q
SQ
RR
Demag
+
50 mV
10 V
Rint
VCC
Drv
Driver src = 20 sink = 10
4.2 V
To Internal
Supply
GND
Fault
Mngt.
+
−
Overload?
5 us
Timeout
Time
Reset
FB
/3
1V
200 mA
when DRV
is OFF
380 ns
CS
LEB
Demag
Figure 2. Internal Circuit Architecture
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Power Supply or Drive Voltage
Transient Power Supply Voltage, Duration < 10 ms, IVCC < 20 mA
Maximum Voltage on all other pins except Pin 8 (HV), Pin 6 (VCC) and Pin 5 (Drv)
Maximum Current into all pins except VCC (6), HV (8) and Demag (1) when 10 V ESD
diodes are activated
VCC, Drv
18
V
VCC Pulse
25
V
−
−0.3 to 10
V
−
5.0
mA
Maximum Current in Pin 1
Idem
+3.0/−2.0
mA
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air, SOIC Version
Thermal Resistance, Junction−to−Air, PDIP Version
Maximum Junction Temperature
Temperature Shutdown
RqJC
RqJA
RqJA
TJMAX
−
57
°C/W
178
°C/W
100
°C/W
150
°C
155
°C
Hysteresis in Shutdown
−
30
°C
Storage Temperature Range
−
−60 to +150
°C
ESD Capability, HBM Model (All pins except VCC and HV)
ESD Capability, Machine Model
−
2.0
kV
−
200
V
Maximum Voltage on Pin 8 (HV), Pin 6 (VCC) Decoupled to Ground with 10 mF
VHV
500
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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