NCV1009 查看數據表（PDF） - ON Semiconductor
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NCV1009 Datasheet PDF : 6 Pages
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NCV1009
MAXIMUM RATINGS*
Rating
Value
Unit
Reverse Current
20
mA
Forward
10
mA
Package Thermal Resistance, SOIC−8:
Junction−to−Case, RqJC
Junction−to−Ambient, RqJA
Package Thermal Resistance, TO−92:
Junction−to−Case, RqJC
Junction−to−Ambient, RqJA
Operating Temperature Range
45
°C/W
165
°C/W
−
170
−40 to +125
°C/W
°C/W
°C
Storage Temperature Range
−65 to +150 °C
Lead Temperature Soldering:
Wave Solder (through hole styles only) (Note 1) 260 peak
°C
Reflow: (SMD styles only) (Notes 2, 3) 240 peak
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
*The maximum package power dissipation must be observed.
1. 10 second maximum
2. 60 second maximum above 183°C.
3. −5°C / +0°C allowable conditions.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified.)
Characteristic
Test Conditions
Min
Typ
Max
Unit
Reverse Breakdown Voltage
Reverse Breakdown Voltage
Reverse Breakdown Voltage
Change with Current
IR = 1.0 mA
−40°C ≤ TA ≤ 125°C
400 mA ≤ IR ≤ 10 mA
2.492
2.500
2.508
V
2.480
2.500
2.508
V
−
(Note 4)
−
2.6
5.0
mV
3.0
6.0
mV
Reverse Dynamic Impedance
IR = 1.0 mA
−
0.2
1.0
W
(Note 4)
−
0.4
1.4
W
Temperature Stability
Average Temperature Coefficient
0°C ≤ TA ≤ 70°C, (Note 5)
0°C ≤ TA ≤ 70°C, (Note 5)
−
1.8
−
−
15
−
Long Term Stabilty
TA = 25°C ±0.1 C, IR = 1.0 mA
−
20
−
4. Denotes the specifications which apply over full operating temperature range.
5. Average temperature coefficient is defined as the total voltage change divided by the specified temperature range.
mV
ppm/°C
ppm/kHr
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