NDD03N60ZT4G 查看數據表（PDF） - ON Semiconductor
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NDD03N60ZT4G Datasheet PDF : 10 Pages
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NDF03N60Z, NDP03N60Z, NDD03N60Z
PACKAGE DIMENSIONS
V
S
−T−
SEATING
PLANE
B
R
4
A
123
K
IPAK
CASE 369D−01
ISSUE B
C
E
Z
F
G
J
H
D 3 PL
0.13 (0.005) M T
DPAK
CASE 369AA−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.027 0.035
E 0.018 0.023
F 0.037 0.045
G 0.090 BSC
H 0.034 0.040
J 0.018 0.023
K 0.350 0.380
R 0.180 0.215
S 0.025 0.040
V 0.035 0.050
Z 0.155 −−−
MILLIMETERS
MIN MAX
5.97 6.35
6.35 6.73
2.19 2.38
0.69 0.88
0.46 0.58
0.94 1.14
2.29 BSC
0.87 1.01
0.46 0.58
8.89 9.65
4.45 5.45
0.63 1.01
0.89 1.27
3.93 −−−
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
B
V
R
−T−
SEATING
PLANE
C
E
4
Z
A
S
H
1 23
U
F
J
L
D 2 PL
0.13 (0.005) M T
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.101
3.0
0.118
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.025 0.035
E 0.018 0.024
F 0.030 0.045
H 0.386 0.410
J 0.018 0.023
L 0.090 BSC
R 0.180 0.215
S 0.024 0.040
U 0.020 −−−
V 0.035 0.050
Z 0.155 −−−
MILLIMETERS
MIN MAX
5.97 6.22
6.35 6.73
2.19 2.38
0.63 0.89
0.46 0.61
0.77 1.14
9.80 10.40
0.46 0.58
2.29 BSC
4.57 5.45
0.60 1.01
0.51 −−−
0.89 1.27
3.93 −−−
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
5.80
0.228
1.6
0.063
6.172
0.243
ǒ Ǔ SCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
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