SFH9202-4/5 查看數據表（PDF） - OSRAM GmbH
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SFH9202-4/5 Datasheet PDF : 11 Pages
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SFH 9202
Löthinweise
Soldering Conditions
Bauform
Type
Drypack
Level acc.
to
IPS-stand.
020
Tauch-, Schwalllötung
Dip, Wave Soldering
Peak Temp. Max. Time in
(solderbath) peak zone
Reflowlötung
Reflow Soldering
Peak Temp. Max. Time
(package in Peak
temp.)
Zone
SFH 9202 4
n. a.
–
260 °C
20 sec.
Kolbenlötung
Iron Soldering
(Iron temp.)
n.a.
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Vorbehandlung nach JEDEC Level 4
Preconditioning acc. to JEDEC Level 4
(nach J-STD-020C)
(acc. to J-STD-020C)
300
˚C
T 250
200
255 ˚C
240 ˚C
217 ˚C
150
100
Ramp Up
50
3 K/s (max)
25 ˚C
0
0
50
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
OHLA0687
260
˚C
+0 ˚C
-5 ˚C
245 ˚C ±5 ˚C
235
˚C
+5 ˚C
-0 ˚C
10 s min
30 s max
120 s max
Ramp Down
6 K/s (max)
100 s max
100
150
200
250
s 300
t
2007-04-03
10
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