TCA0372BDWR2G 查看數據表（PDF） - ON Semiconductor
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TCA0372BDWR2G Datasheet PDF : 10 Pages
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TCA0372, TCA0372B, NCV0372B
PACKAGE DIMENSIONS
D
A
16
9
SOIC−16 WB
CASE 751G−03
ISSUE D
q
1
8
16X B
B
0.25 M T A S B S
14X
e
C
T
SEATING
PLANE
SOLDERING FOOTPRINT*
16X 0.58
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0_ 7_
11.00
1
16X
1.62
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
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