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TSMBJ1005C-064 查看數據表(PDF) - Micro Commercial Components

零件编号
产品描述 (功能)
生产厂家
TSMBJ1005C-064
MCC
Micro Commercial Components MCC
TSMBJ1005C-064 Datasheet PDF : 4 Pages
1 2 3 4
MCC
  omponents
21201 Itasca Street Chatsworth

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TSMBJ1005C-064
Features
Oxide-Glass passivated Junction
Bi-Directional protection in a single device
Surge capabilities up to 100A@10/1000us or 400A@8/20us
High Off-State impedance and Low On-State voltage
Plastic material has UL flammability classification 94V -0
Transient Voltage
Protection Device
58 Volts
Mechanical Data
Case : Molded plastic
Polarity : None cathode band denotes
Approx Weight : 0.093grams
Maximum Ratings
Characteristic
Non-repetitive peak
impulse current
Non-repetitive peak
On-state current
Operating temperature
range
Junction and storage
temperature range
Symbol
IPP
ITSM
TOP
TJ, TSTG
Value
Unit
100A 10/1000us
50A
8.3ms, one-half
cycle
-40~150oC
-55~150oC
Thermal Resistance
Characteristic
Thermal Resistance
junction to lead
Thermal Resistance
junction to ambient
Typical positive
temperature
coefficient for
breakdown voltage
Symbol
RqJL
RqJA
VBR/TJ
Value
20oC/W
100oC/W
Unit
On recommended
pad layout
0.1%/oC
DO-214AA
(SMBJ)
H
Cathode Band
J
A
C
E
F
D
B
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.078
.096
B
.077
.083
C
.002
.008
D
---
.02
E
.030
.060
F
.065
.091
G
.205
.220
H
.160
.180
J
.130
.155
MM
MIN
2.00
1.96
.05
---
.76
1.65
5.21
4.06
3.30
MAX
2.44
2.10
.20
.51
1.52
2.32
5.59
4.57
3.94
SUGGESTED SOLDER
PAD LAYOUT
0.090"
NOTE
0.085”
0.070”
www.mccsemi.com

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