HCPL-5201-300 查看數據表（PDF） - Avago Technologies
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HCPL-5201-300 Datasheet PDF : 14 Pages
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Functional Diagram
Multiple Channel Devices Available
Truth Tables
(Positive Logic)
V CC
Multichannel Devices
VO
Input
Output
VE
On (H)
H
Off (L)
L
GND
Package styles for these parts are 8 pin DIP through hole
(case outline P), 16 pin DIP flat pack (case outline F), and
leadless ceramic chip carrier (case outline 2). Devices may
be purchased with a variety of lead bend and plating
options, see Selection Guide Table for details. Standard
Microcircuit Drawing (SMD) parts are available for each
package and lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and perfor�
mance characteristics shown in the figures are identical
for all parts. Occasional exceptions exist due to package
variations and limitations and are as noted. Additionally,
the same package assembly processes and materials are
used in all devices. These similarities give justification for
the use of data obtained from one part to represent other
part’s performance for die related reliability and certain
limited radiation test results.
Single Channel Devices
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
Z
Z
H
L
Functional Diagrams
8 Pin DIP
Through Hole
1 Channel
1
V CC
8
2
VO
7
3
6
VE
4
5
GND
8 Pin DIP
Through Hole
2 Channels
1
V CC 8
V O1
2
7
V O2
3
6
4
5
GND
16 Pin Flat Pack
Unformed Leads
4 Channels
1
16
2
V CC 15
3
V O1 14
4
V O2 13
5
V O3 12
6
V O4 11
7
GND 10
8
9
20 Pad LCCC
Surface Mount
2 Channels
15
V CC2
19
V O2
13
20
GND 2 12
2
V O1 V CC1 10
3
GND 1
78
Note: Multichannel DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 6. LCCC (leadless ceramic chip
carrier) package has isolated channels with separate VCC and ground connections.
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