AD629BNZ(RevC) 查看數據表（PDF） - Analog Devices
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AD629BNZ Datasheet PDF : 16 Pages
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AD629
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage, VS
Internal Power Dissipation1
8-Lead PDIP (N)
8-Lead SOIC (R)
Input Voltage Range, Continuous
Common-Mode and Differential, 10 sec
Output Short-Circuit Duration
Pin 1 and Pin 5
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering 60 sec)
Rating
±18 V
See Figure 4
See Figure 4
±300 V
±500 V
Indefinite
–VS − 0.3 V to +VS + 0.3 V
150°C
−55°C to +125°C
−65°C to +150°C
300°C
1 Specification is for device in free air:
8-Lead PDIP, θJA = 100°C/W;
8-Lead SOIC, θJA = 155°C/W.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
2.0
TJ = 150°C
8-LEAD PDIP
1.5
1.0
8-LEAD SOIC
0.5
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE (°C)
Figure 4. Maximum Power Dissipation vs. Temperature for SOIC and PDIP
1a 1b
2
7
Y
3
4
6b
6a
5a 5b
X
DIE SIZE: 1655µm (X) by 2465µm (Y)
Figure 5. Metallization Photograph
Table 3. Pin Pad Coordinates
Coordinates1
Pad Pin
X
Y
1a REF(−) −677 +1082
1b
−534 +1084
2 −IN
3 +IN
4
−VS
5a REF(+)
5b
−661
−661
+680
+396
+538
+939
−658
−800
−1084
−1084
6a OUTPUT +681 −950
6b
+681 −807
7
+VS
+680 +612
Description
For the die model, either
pad can be bonded because
1a and 1b are internally
shorted.
For the die model, either
pad can be bonded because
5a and 5b are internally
shorted.
For the die model, both
pads must be bonded
because 6a and 6b are not
internally shorted.
1 All coordinates are with respect to the center of the die.
ESD CAUTION
Rev. C | Page 4 of 16
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