TDA8552TS 查看數據表（PDF） - NXP Semiconductors.

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TDA8552TS

2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing

NXP Semiconductors. 

NXP Semiconductors

2 x 1.4 W BTL audio amplifiers with digital

volume control and headphone sensing

Product specification

TDA8552T; TDA8552TS

FEATURES

• One pin digital volume control (for each channel)

• Volume setting with up/down pulses

• Auto repeat function on volume setting

• Headphone sensing

• Maximum gain set by selection pin

• Low sensitivity for EMC radiation

• Internal feedback resistors

• Flexibility in use

• Few external components

• Low saturation voltage of output stage

• Standby mode controlled by CMOS compatible levels

• Low standby current

• No switch-on/switch-off plops

• High supply voltage ripple rejection

• Protected against electrostatic discharge

• Outputs short-circuit safe to ground, VDD and across the

load

• Thermally protected.

APPLICATIONS

• Portable consumer products

• Notebook computers

• Communication equipment.

GENERAL DESCRIPTION

The TDA8552T is a two channel audio power amplifier that

provides an output power of 2 × 1.4 W into an 8 Ω load

using a 5 V power supply. The circuit contains two BTL

power amplifiers, two digital volume controls and

standby/mute logic. Volume and balance of the amplifiers

are controlled using two digital input pins which can be

driven by simple push-buttons or by a microcontroller.

Using the selection pin (GAINSEL) the maximum gain can

be set at 20 or 30 dB. The headphone sense input (HPS)

can be used to detect if a headphone is plugged into the

jack connector. If a headphone is plugged into the jack

connector the amplifier switches from the BTL to the SE

mode and the BTL loudspeakers are switched off. This

also results in a reduction of quiescent current

consumption.

The TDA8552T is contained in a 20-pin small outline

package. For the TDA8552TS, which is contained in a

20-pin very small outline package, the maximum output

power is limited by the maximum allowed ambient

temperature. More information can be found in Section

“Thermal design considerations”. The SO20 package has

the four corner leads connected to the die pad so that the

thermal behaviour can be improved by the PCB layout.

ORDERING INFORMATION

TYPE

NUMBER

TDA8552T

TDA8552TS

PACKAGE

NAME

DESCRIPTION

SO20 plastic small outline package; 20 leads; body width 7.5 mm

SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm

VERSION

SOT163-1

SOT266-1

2002 Jan 04

2

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