MC74VHC1G32 查看數據表（PDF） - ON Semiconductor
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MC74VHC1G32 Datasheet PDF : 8 Pages
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MC74VHC1G32
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VIN
VOUT
IIK
IOK
IOUT
ICC
TSTG
TL
TJ
qJA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
SC70−5/SC−88A (Note 1)
TSOP−5
*0.5 to )7.0
−0.5 to +7.0
*0.5 to VCC )0.5
−20
$20
$12.5
$25
*65 to )150
260
)150
350
230
V
V
V
mA
mA
mA
mA
°C
°C
°C
°C/W
PD
Power Dissipation in Still Air at 85°C
SC70−5/SC−88A
150
mW
TSOP−5
200
MSL
FR
VESD
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Level 1
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
u2000
V
Machine Model (Note 3)
u200
Charged Device Model (Note 4)
N/A
ILATCH−UP
Latch−Up Performance
Above VCC and Below GND at 125°C (Note 5)
$500
mA
Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute−maximum−rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
VIN
VOUT
TA
tr , tf
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
2.0
0.0
0.0
−55
VCC = 3.3 V ± 0.3 V
0
VCC = 5.0 V ± 0.5 V
0
5.5
5.5
VCC
+125
100
20
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time
Junction Temperature
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