P0404FC05C(2005) 查看數據表（PDF） - ProTek Devices.

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P0404FC05C
(Rev.:2005)

FLIP CHIP ARRAY

ProTek Devices. 

PACKAGE OUTLINE & DIMENSIONS

PACKAGE OUTLINE

TOP

E

F

H

END

I

P0404FC3.3C*

thru

P0404FC24C*

PACKAGE DIMENSIONS

DIM MILLIMETERS

INCHES

A

0.56 NOM

0.022 NOM

B

0.86 NOM

0.034 NOM

C

1.0 ± 0.02

0.039 ± 0.001

E

0.15 SQ

0.006 SQ

F

1.0 ± 0.0254

0.039 ± 0.001

G

0.15 NOM

0.006 NOM

H

0.127 MAX

0.005 MAX

0.076 MIN

0.003 MIN

I

0.406 NOM

0.016 NOM

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and

outline: .xxx ± 0.05mm (± 0.002”).

MOUNTING PAD LAYOUT - Option 1

C

A

DIE

SOLDER

BUMP

I

PAD DIMENSIONS

DIM MILLIMETERS

A

0.51

C

0.30

D

0.46

E

0.20

F

0.15 SQ

G

0.71

H

0.99

I

0.51

INCHES

0.020

0.012

0.018

0.008

0.006 SQ

0.028

0.039

0.020

NOTE:

1. Preferred: Using 0.1mm (0.004”) stencil.

SOLDER PRINT

0.010” - 0.012” DIA.

SOLDER PADS

SOLDER MASK

Outline & Dimensions: Rev 4 - 9/04, 06022

05154.R5 4/05

*U.S. Patent No. Des. “D456,367S”

5

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