ULC0408FC08C 查看數據表（PDF） - ProTek Devices.

零件编号

产品描述 (功能)

生产厂家

ULC0408FC08C

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

ProTek Devices. 

PACKAGE OUTLINE & DIMENSIONS

ULC0408FC3.3C

thru

ULC0408FC36C

MOUNTING PAD LAYOUT - Option 2

COPPER CONTACT 0.009” [0.23] DIA.

A

DIE

SOLDER

CONTACT

I

PACKAGE DIMENSIONS

DIM MILLIMETERS

A

0.51

F

0.15 SQ

G

0.71

H

0.99

I

0.51

INCHES

0.020

0.006 SQ

0.028

0.039

0.020

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and

outline: .xxx ± 0.05mm (± 0.002”).

3. Preferred: Using 0.1mm (0.004”) stencil.

Outline & Dimensions: Rev 3 - 2/04, 06026

TAPE & REEL ORIENTATION

SOLDER PRINT 0.014” [0.36] DIA.

SOLDER

MASK

Quad Die - 0408

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and

reeled in accordance with EIA 481.

2. 8mm Plastic Tape: 7 Inch Reels - 5,000

pieces per reel. Ordering Suffix: -T75-1

(i.e., ULC0408FC05C-T75-1).

3. 8mm Paper Tape: 7 Inch Reels -5,000

pieces per reel. Ordering Suffix: -T75-2

(i.e., ULC0408FC05C-T75-2).

COPYRIGHT © ProTek Devices 2005

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and

specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or

specifications of such products.

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282

Tel: 602-431-8101 Fax: 602-431-2288

E-Mail: sales@protekdevices.com

Web Site: www.protekdevices.com

05170.R5 4/05

6

www.protekdevices.com

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