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STPS8H100FP 查看數據表(PDF) - STMicroelectronics

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STPS8H100FP
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS8H100FP Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
STPS8H100D/F/G/R/FP
Fig. 6-2: Relative variation of thermal impedance
junction to case versus pulse duration
(ISOWATT220AC, TO-220FPAC).
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
Zth(j-c)/Rth(j-c)
1.0
0.8
0.6 δ = 0.5
0.4
δ = 0.2
0.2 δ = 0.1
0.0
1E-3
Single pulse
1E-2
tp(s)
1E-1
T
δ=tp/T
1E+0
tp
1E+1
IR(µA)
5E+3
1E+3
Tj=125°C
1E+2
1E+1
1E+0
1E-1
1E-2
0
Tj=25°C
VR(V)
10 20 30 40 50 60 70 80 90 100
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
C(nF)
1000
500
F=1MHz
Tj=25°C
200
100
1
VR(V)
10
100
Fig. 9: Forward voltage drop versus forward
current (maximum values).
IFM(A)
50.0
10.0
Tj=125°C
Tj=25°C
1.0
0.1
0
VFM(V)
0.2 0.4 0.6 0.8 1
1.2 1.4 1.6
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness:
35µm)(D2PAK).
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
S(Cu) (cm²)
0
0 4 8 12 16 20 24 28 32 36 40
4/8

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