SFC05-5(2003) 查看數據表（PDF） - Protek Devices

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SFC05-5
(Rev.:2003)

FLIP CHIP ARRAY

Protek Devices 

PACKAGE OUTLINE & DIMENSIONS

PACKAGE OUTLINE

B

TOP

E

F

H

END

I

MOUNTING PAD LAYOUT - Option 1

A

DIE

SOLDER

BUMPS

G

SOLDER PRINT

0.010” - 0.012” DIA.

SOLDER PADS

SOLDER MASK

SFC05-5

PACKAGE DIMENSIONS

DIM MILLIMETERS

INCHES

A

0.510

0.020

B

0.510

0.020

C

0.99 ± 0.0254 0.039 ± 0.001

E

0.15 NOM

0.006 NOM

F

1.5 ± 0.0254

0.059 ± 0.001

G

0.15 NOM

0.006 NOM

H

See Note 3

See Note 3

0.076 MIN

0.003 MIN

I

0.419 NOM

0.0165 NOM

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and

outline: .xxx ± 0.05mm (± 0.002”).

3. “H” Dimensions for the SFC05-5 device

are 0.10mm Max and 0.004” Max.

PAD DIMENSIONS

DIM MILLIMETERS

INCHES

A

0.305

B

0.457

C

0.203

D

0.254

E

0.510

F

0.990

G

0.510

0.012

0.018

0.008

0.010

0.020

0.039

0.020

NOTE:

1. Preferred: Using 0.1mm (0.004”) stencil.

Outline & Dimensions: Rev 1 - 1/03, 06038

05130.R6 8/03

4

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