SFC05-5(2003) 查看數據表（PDF） - Protek Devices
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SFC05-5 Datasheet PDF : 5 Pages
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PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
A
COPPER CONTACTS
0.009” [0.23] DIA.
DIE
SOLDER
BUMPS
E
SFC05-5
PACKAGE DIMENSIONS
DIM MILLIMETERS
A
1.5 NOM
B
0.152 NOM
C
0.510
D
0.990
E
0.510
INCHES
0.059
0.006 NOM
0.020
0.039
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 0 - 10/02, 06039
TAPE & REEL ORIENTATION
SOLDER PRINT
0.014” [0.36] DIA.
SOLDER MASK
1
6
2
5
3
4
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., SFC05-5-T75-1).
3. 8mm Paper Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-2
(i.e., SFC05-5-T75-2).
COPYRIGHT © ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
05130.R6 8/03
5
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
www.protekdevices.com
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