SF2012901YL 查看數據表（PDF） - ABC Taiwan Electronics Corp
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SF2012901YL Datasheet PDF : 7 Pages
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SPECIFICATION FOR APPROVAL
REF : 20090324-B
PAGE: 6
PROD.
NAME
SMD LINE FILTER
ABC'S DWG NO.
ABC'S ITEM NO.
SF2012□□□□L□-□□□
Ⅸ﹒RELIABILITY TEST：
1-1.Environmental Performance
No
Item
Specification
1-1-1 Temperature Cycle
Appearance: No Damage
Impedance: within±20% of
initial value
1-1-2 Humidity Resistance
1-1-3 High Temperature Resistance
1-1-4 Low Temperature Resistance
1-1-5 High Temperature Load Life There should be no evidence
of short or open circle
1-1-6 Humidity Load Life
1-2.Mechanical Performance
No
Item
1-2-1 Resistance To Soldering Heat
Specification
Appearance: No Damage
1-2-2 Solder ability
1-2-3 Commponent Adhesion
(Push Test)
The Electrodes Shall Be
At Least 90% Covered
with New Solder Coating
2 Lbs
Test Method
One cycle:
Step Temperature (℃)
1 -25±3
2 25±2
3 85±3
4 25±2
Time (min)
30
3
30
3
Total: 5 cycles
Measured After Exposure in The Room Condition For 1hrs
Temperature: 40±2℃
Relative Humidity: 90 ~ 95%
Time: 100hrs
Measured After Exposure In The Room Condition For 1hrs
Temperature: 85±3℃
Time: 50Hrs
Measured After Exposure In The Room Condition For 1Hrs
Temperature: -25±3℃
Time: 50Hrs
Measured After Exposure In The Room Condition For 1Hrs
Temperature: 85±3℃
Load: Allowed DC Current
Time: 500Hrs
Temperature: 40±2℃
Relative Humidity: 90~95%
Load: Allowed DC Current
Time: 500Hrs
Test Method
1. The Device Should Be Reflow soldered on PCB
(peak 260℃±5℃ For 10 Seconds)
2. Solder Composition: Sn/Ag3.0/Cu0.5
3. Test Time: 6 minutes
1. Pre-Heating: 150℃,1min.
2. Solder Composition: Sn/Ag3.0/Cu0.5
3. Solder Temperature: 245±5℃.
4. Immersion Time: 4±1 sec.
The device should be reflow soldered (230±5℃ For
10 seconds) to a tinned copper substrate. A force guauge
should be applied to the side of the component.
The device must withstand a minimum force of 2 pounds
without a failure of the termination attached to component
AR-001A
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