UPC2776TB-E3 查看數據表（PDF） - NEC => Renesas Technology
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UPC2776TB-E3 Datasheet PDF : 12 Pages
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µPC2776TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor (e.g. 1 000 pF) should be attached to VCC pin.
(4) The inductor must be attached between VCC and output pin (e.g. 100 nH)
(5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and condi-
tions than the recommended conditions are to be consulted with our sales representatives.
µPC2776TB
Soldering method
Infrared ray reflow
VPS
Wave soldering
Pin part heating
Soldering conditions
Package peak temperature: 235 °C, Hour: within 30 s.
(more than 210 °C), Time: 3 times, Limited days: no.Note
Package peak temperature: 215 °C, Hour: within 40 s.
(more than 200 °C), Time: 3 times, Limited days: no.Note
Soldering tub temperature: less than 260 °C, Hour: within 10 s.
Time: 1 time, Limited days: no.Note
Pin area temperature: less than 300 °C, Hour: within 3 s/pin.
Limited days: no.Note
Recommended condition symbol
IR35-00-3
VP15-00-3
WS60-00-1
Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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