MMXZ5223B-TP 查看數據表（PDF） - Micro Commercial Components
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MMXZ5223B-TP Datasheet PDF : 5 Pages
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
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MMXZ5223B
THRU
MMXZ5259B
Features
Lead Free Finish/RoHS Compliant ("P" Suffix
designates RoHS Compliant. See ordering information)
Planar Die construction
Zener Voltages from 2.7V-39V and 200mW Power Dissipation
Halogen free available upon request by adding suffix "-HF"
Ideally Suited for Automated Assembly Processes
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Approx. Weight: 0.008 gram
Mounting Position: Any
Storage & Operating Junction Temperature: -55oC to +150oC
Maximum Ratings @ 25oC Unless Otherwise Specified
Forward Current
IF
Maximum Forward
VF
Voltage(Notes 1)
Power Dissipation
PD
(No te s 2)
Thermal Resistance, Rthja
Junction to Ambient Air
10
mA
0.9
V
200 mWatt
625
oC/W
NOTES:
1. Tested with pulses, Tp<1.0ms
2. Device mounted on ceramic PCBS; 7.6 mm x 9.4 mm x 0.87 mm
with pad areas 25 mm2.
200 mW
Zener Diodes
2.7 to 39 Volts
SOD-323
A
B
C
E
H
D
G
J
DIMENSIONS
DIM
INCHES
MM
NOTE
MIN MAX MIN MAX
A .090 .107 2.30 2.70
B .063 .071 1.60 1.80
C .045 .053 1.15 1.35
D .031 .045 0.80 1.15
E .010 .016 0.25 0.40
G .004 .018 0.10 0.45
H .004 .010 0.10 0.25
J ----- .006 ----- 0.15
SUGGESTED SOLDER
PAD LAYOUT
0.074"
0.027”
0.022”
Revision: C
www.mccsemi.com
1 of 5
2013/01/01
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