SMC1502203FLF7 查看數據表（PDF） - IRC - a TT electronics Company.
零件编号
产品描述 (功能)
生产厂家
SMC1502203FLF7
IRC - a TT electronics Company.
SMC1502203FLF7 Datasheet PDF : 3 Pages
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Cylindrical Surface Mount
Metal Glaze™ Compliant
Terminal Resistors
SMC Series
• Lead free, RoHS compliant
• Uses standard IRC 2512, 3610 solder pads
• Ideal for automotive and other harsh thermal applications
• Uncompromising Metal Glaze™ performance gives excellent
surge performance
• Capped terminals provide mechanical compliance-relief from
board vs. component TCE mismatch
Electrical Data
IRC
Type
Industry
Standard
Footprint
Power
Rating @ 70°C
(Watts)
Resistance
Range
(Ohms)
SMC-1
2512
1.0
0.5 to 1M
Tolerance
TCR
(±%)1
(±ppm/°C)
1, 2, 5
100
Operating
Voltage
(V)
350
Maximum
Voltage
(V)
650
SMC-2
3610
2.0
Notes:
1 For tolerances below ±1%, please contact factory.
0.5 to 2M
1, 2, 5
100
500
1000
Environmental Data
Characteristics
Temperature Coefficient (ppm/°C)
Maximum Change
As specified
Thermal Shock
±0.5% +0.01Ω
Low Temperature Operation
Short Time Overload
High Temperature Exposure
±0.25% +0.01Ω
±0.5% +0.01Ω
±1% for (R>100KΩ)
±0.5% +0.01Ω
Resistance to Bonding
±0.25% +0.01Ω
Solderability
95% minimum coverage
Moisture Resistance
±0.5% +0.01Ω
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
±0.5% +0.01Ω
±1% +0.01
no mechanical damage
±1% +0.01
no mechanical damage
Operating Temperature
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Test Method
MIL-PRF-55342E Par 4.7.9
(-55°C to +125°C)
MIL-PRF-55342E Par 4.7.3
(-65°C to +150°C)
MIL-PRF-55342E Par 4.7.4
(-65°C @ working voltage)
MIL-PRF-55342E Par 4.7.5
(2.5 x √ PxR for 5 seconds)
MIL-PRF-55342E Par 4.7.6
(+150°C for 100 hours)
MIL-PRF-55342E Par 4.7.7
(Reflow soldered to board @ 260°C for 10 seconds)
MIL-STD-202, Method 208
(245°C for 5 seconds)
MIL-PRF-55342E Par 4.7.8
(10 cycles, total 240 hours)
MIL-PRF-55342E Par 4.7.10
(2000 hours @ 70°C intermittent)
1200 gram push from underside of
mounted chip for 60 seconds
Chip mounted in center of 90mm long board,
deflected 5mm so as to exert pull on chip contacts
for 10 seconds
-55°C to +150°C
A subsidiary of
TT electronics plc
SMC Series Issue April 2009 Sheet 1 of 3
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