MAX4928BETN 查看數據表（PDF） - Maxim Integrated

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MAX4928BETN

DisplayPort/PCIe Passive Switches

Maxim Integrated 

DisplayPort/PCIe Passive Switches

ABSOLUTE MAXIMUM RATINGS

(All voltages referenced to GND, unless otherwise noted.)

VDD ...........................................................................-0.3V to +4V

LE, SEL, IN_, X_, OUT_, D_, TX_, HPD_, RX_, AUX_

(Note 1) ...............................................-0.3V to + (VDD + 0.3V)

|VIN_ - VTX_|, |VIN_ - VD_|, |VX_ - VHPD_|, |VX_ - VRX1_|,

|VOUT_ - VAUX_|, |VOUT_ - VRX0_| (Note 1) ...................0 to +2V

Continuous Current (IN_ to D_/TX_, X_ to HPD_/RX1_,

OUT_ to AUX_/RX0_ .....................................................±70mA

Peak Current (IN_ to D_/TX_, X_ to HPD_/RX1_, OUT_ to

AUX_/RX0_) (pulsed at 1ms, 10% duty cycle) .............±70mA

Continuous Current (LE, SEL)...........................................±30mA

Peak Current (LE, SEL)

(pulsed at 1ms, 10% duty cycle)..................................±70mA

Continuous Power Dissipation (TA = +70°C) for Multilayer Board

56-Pin TQFN (derate 41.0mW/°C above +70°C) .......3279mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Package Junction-to-Ambient Thermal Resistance (θJA)

(Note 2) .....................................................................24.4°C/W

Package Junction-to-Case Thermal Resistance (θJC)

(Note 2) .......................................................................1.5°C/W

Lead Temperature (soldering) .........................................+300°C

Note 1: Signals on IN_, X_, OUT_, D_, TX_, HPD_, RX_, or AUX_, LE, SEL exceeding VDD or GND are clamped by internal diodes.

Limit forward-diode current to maximum current rating.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer

board. For detailed information on package thermal considerations, see www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VDD = +3.3V ±10%, TA =TMIN to TMAX, unless otherwise noted. Typical values are at VDD = +3.3V, TA = +25°C, unless otherwise

noted.) (Note 3)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

ANALOG SWITCH

Analog Signal Range

IN_, X_, OUT_,

D_, TX_, HPD_,

RX_, AUX_

-0.1

(VDD -

V

1.8)

Voltage Between IN and D/TX, X

and HPD/RX1, and OUT and

AUX/RX0

|VIN_ - VTX_|,

|VIN_ - VD_|,

|VX_ - VHPD_|,

|VX_ - VRX1_|,

|VOUT_ -

VAUX_|,

|VOUT_ - VRX0_|

0

1.8

V

On-Resistance

RON

IIN_ = IX_ = IOUT_ = 15mA, VD_, VTX_,

VHPD_, VAUX_, or VRX_ = 0V, +1.2V

8

Ω

On-Resistance Match

Between Pairs of Same Channel

On-Resistance Match

Between Channels

ΔRON

ΔRON

VDD = +3.0V, IIN_ = IX_ = IOUT_= 15mA,

VD_, VTX_, VHPD_, VAUX_, or VRX_ = 0V

(Notes 4, 5)

VDD = +3.0V, IIN_ = IX_ = IOUT_= 15mA,

VD_, VTX_, VHPD_, VAUX_, or VRX_ = 0V

(Notes 4, 5)

0.1

2

Ω

1.5

4

On-Resistance Flatness

RFLAT(ON)

VDD = +3.0V, IIN_ = IX_ = IOUT_= 15mA,

VD_, VTX_, VHPD_, VAUX_, or VRX_ = 0V,

+1.2V (Notes 5, 6)

0.3

1.5

Ω

2 _______________________________________________________________________________________

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