SMDJ5.0A-HRA 查看數據表（PDF） - Littelfuse, Inc
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SMDJ5.0A-HRA Datasheet PDF : 6 Pages
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Transient Voltage Suppression Diodes
Surface Mount – 3000W > SMDJ-HRA series
Soldering Parameters
Reflow Condition
TVS DioLedade–frAee rarssaemybsly (SPA™Family of Products)
TP
- Temperature Min (Ts(min))
150°C
Pre Heat - Temperature Max (Ts(max))
200°C
TL
- Time (min to max) (ts)
60 – 180 secs
Ts(max)
Average ramp up rate (Liquidus Temp
(TL) to peak
3°C/second max
Ts(min)
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow -Temperature (TL) (Liquidus) 217°C
25˚C
- Time (min to max) (ts)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Ramp-up
ts
Preheat
t 25˚C to Peak
Time (t)
Time 25°C to peak Temperature (TP)
Do not exceed
8 minutes Max.
280°C
Environmental Specifications
tp
tL
Critical Zone
TL to TP
Ramp-down
Physical Specifications
Weight
Case
Polarity
Terminal
0.007 ounce, 0.21 grams
JEDEC DO214AB. Molded plastic body
over glass passivated junction
Color band denotes positive end
(cathode) except Bidirectional.
Matte Tin-plated leads, Solderable per
JESD22-B102D
High Temp. Storage
HTRB
Thermal Shock
MSL
H3TRB
RSH
JESD22-A103
JESD22-A108
JESD22-A106
JEDEC-J-STD-020C, Level 1
JESD22-A101
JESD22-B106C
Dimensions
DO-214AB (SMC J-Bend)
Cathode Band
(for Uni-directional products only)
A
C
D
E
J
B
H
F
G
K
L
I
Solder Pads
(all dimensions in mm)
SMDJ-HRA Series
Dimensions
A
B
C
D
E
F
G
H
I
J
K
L
Inches
Min
Max
0.114
0.126
0.260
0.280
0.220
0.245
0.079
0.103
0.030
0.060
0.002
0.008
0.305
0.320
0.006
0.012
0.129
-
0.094
-
-
0.094
0.165
-
Millimeters
Min
Max
2.900
3.200
6.600
7.110
5.590
6.220
2.060
2.620
0.760
1.520
0.051
0.203
7.750
8.130
0.152
0.305
3.300
-
2.400
-
2.400
4.200
-
5
©2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/18/13
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