Package and PCB thermal data
4
Package and PCB thermal data
4.1
PowerSSO-12 thermal data
Figure 29. PowerSSO-12 PC board
L5150GJ
.
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1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias,
FR4 area = 77 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness = 70 µm (front and back side) thermal
vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm,
footprint dimension 4.1 mm x 6.5 mm ).
Figure 30. Rthj-amb vs PCB copper area in open box free air condition
57+MBDPE.:
3&%&XKHDWVLQNDUHDFPA
*$3*36
20/29
Doc ID 15540 Rev. 12