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SPA16N50C3(2007) 查看數據表(PDF) - Infineon Technologies

零件编号
产品描述 (功能)
生产厂家
SPA16N50C3
(Rev.:2007)
Infineon
Infineon Technologies Infineon
SPA16N50C3 Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
SPP16N50C3
SPI16N50C3, SPA16N50C3
Maximum Ratings
Parameter
Drain Source voltage slope
VDS = 400 V, ID = 16 A, Tj = 125 °C
Symbol
dv/dt
Value
50
Unit
V/ns
Thermal Characteristics
Parameter
Thermal resistance, junction - case
Thermal resistance, junction - case, FullPAK
Thermal resistance, junction - ambient, leaded
Thermal resistance, junction - ambient, FullPAK
Soldering temperature, wavesoldering
1.6 mm (0.063 in.) from case for 10s3)
Symbol
RthJC
RthJC_FP
RthJA
RthJA FP
Tsold
Values
min. typ. max.
-
- 0.78
-
-
3.7
-
-
62
-
-
80
-
- 260
Unit
K/W
°C
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter
Symbol Conditions
Values
Unit
min. typ. max.
Drain-source breakdown voltage V(BR)DSS VGS=0V, ID=0.25mA 500
-
-V
Drain-Source avalanche
breakdown voltage
V(BR)DS VGS=0V, ID=16A
-
600
-
Gate threshold voltage
VGS(th) ID=675µA, VGS=VDS 2.1
3
3.9
Zero gate voltage drain current IDSS
VDS=500V, VGS=0V,
µA
Tj=25°C
-
0.1
1
Tj=150°C
-
-
100
Gate-source leakage current
I GSS
VGS=20V, VDS=0V
-
- 100 nA
Drain-source on-state resistance RDS(on) VGS=10V, ID=10A
Tj=25°C
- 0.25 0.28
Tj=150°C
- 0.68 -
Gate input resistance
RG
f=1MHz, open drain
-
1.5
-
Rev. 3.0
Page 2
2007-08-30

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