BAP64-05W,115 查看數據表（PDF） - NXP Semiconductors.
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BAP64-05W,115 Datasheet PDF : 11 Pages
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NXP Semiconductors
8 Package outline
Plastic surface-mounted package; 3 leads
D
B
BAP64-05W
Silicon PIN diode
SOT323
E
A
X
y
3
1
e1
bp
e
2
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1 HE Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25 2.2
0.10 1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45 0.23
0.15 0.13
0.2
0.2
OUTLINE
VERSION
IEC
SOT323
REFERENCES
JEDEC
JEITA
SC-70
Figure 6. Package outline SOT323
BAP64-05W
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 1 February 2019
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
© NXP B.V. 2019. All rights reserved.
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