SZBZX84C2V4ET1G(2012) 查看數據表（PDF） - ON Semiconductor

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SZBZX84C2V4ET1G
(Rev.:2012)

Zener Voltage Regulators

ON Semiconductor 

BZX84CxxxET1G Series,

SZBZX84CxxxET1G Series

Zener Voltage Regulators

225 mW SOT−23 Surface Mount

This series of Zener diodes is offered in the convenient, surface

mount plastic SOT−23 package. These devices are designed to provide

voltage regulation with minimum space requirement. They are well

suited for applications such as cellular phones, hand held portables,

and high density PC boards.

Specification Features

 225 mW Rating on FR−4 or FR−5 Board

 Zener Breakdown Voltage Range − 2.4 V to 75 V

 Package Designed for Optimal Automated Board Assembly

 Small Package Size for High Density Applications

 ESD Rating of Class 3 (> 16 kV) per Human Body Model

 Peak Power − 225 W (8 X 20 ms)

 AEC−Q101 Qualified and PPAP Capable

 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

 Pb−Free Packages are Available*

Mechanical Characteristics

CASE: Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260C for 10 Seconds

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

MAXIMUM RATINGS

Rating

Symbol Max Unit

Peak Power Dissipation @ 20 ms (Note 1)

@ TL  25C

Total Power Dissipation on FR−5 Board,

(Note 2) @ TA = 25C

Derated above 25C

Thermal Resistance, Junction−to−Ambient

Total Power Dissipation on Alumina

Substrate, (Note 3) @ TA = 25C

Derated above 25C

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature Range

Ppk

225

W

PD

RqJA

PD

RqJA

TJ, Tstg

225

1.8

556

300

2.4

417

−65 to

+150

mW

mW/C

C/W

mW

mW/C

C/W

C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Nonrepetitive current pulse per Figure 9.

2. FR−5 = 1.0 X 0.75 X 0.62 in.

3. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012

1

January, 2012 − Rev. 8

http://onsemi.com

SOT−23

CASE 318

STYLE 8

3

Cathode

1

Anode

MARKING DIAGRAM

xxx M G

G

1

xxx = Device Code

M

= Date Code*

G

= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

ORDERING INFORMATION

Device

Package

Shipping†

BZX84CxxxET1G

SOT−23

(Pb−Free)

3,000 /

Tape & Reel

SZBZX84CxxxET1G SOT−23

(Pb−Free)

3,000 /

Tape & Reel

BZX84CxxxET3G

SOT−23

(Pb−Free)

10,000 /

Tape & Reel

SZBZX84CxxxET3G SOT−23

(Pb−Free)

10,000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 of

this data sheet.

Publication Order Number:

BZX84C2V4ET1/D

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